BGA
▪Reliable encapsulation ▪ Stable operation ▪ Excellent thermal dissipation
BGA enables compact, high-speed designs with higher density, superior thermal dissipation and electrical performance, making it the mainstream choice for embedded and high-performance chips.
Product Features
▪ Low power extends battery life
▪ Data reliability ensures data security
▪ High integration simplifies terminal design
▪ High-speed read/write meets diverse needs
▪Standardized interfaces ensure strong compatibility
BGA
Application Area
Customized Service
As an original manufacturer with end-to-end production and an experienced technical team, our in-depth insight into diverse applications enable us to design and produce highly reliable and compatible eMMC products.
Product Parameter
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Item
|
Specification
|
Description
|
Unit
|
|
Overview
|
Interface | NFI 4.2 & 5.1 & 5.0 |
/
|
| Size | 18 ×12 |
mm
|
|
| Durability | Waterproof/Drop-proof/Wear-resistant/X-ray-proof/Vibration-proof; Magnetic-proof/Shock-proof |
/
|
|
| HS code | 8542321090 | ||
|
Performance
|
Capacity | 32-512 |
GB
|
| Flash | 3D NAND |
/
|
|
| Packaging | BGA132 |
/
|
|
|
Work/Storage Environment
|
Working Temperature | Consumer grade:-0C~70°℃/Industrial grade:-40°C~85℃ |
℃
|
| Storage Temperature | -20-85 |
℃
|
|
| working voltage | 2.7-3.6 |
V
|
|
| Humidity | 0-95 | % | |
|
Warranty
|
/ | 3 |
Years
|
|
OEM/ODM
|
/ | Custom printing logo/code/label/package etc. |
/
|
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Certification
|
/ | CE/ROHS/REACH/FCC |
/
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*Note: The data are tested in Novus Lab, and the actual performance may vary due to different equipment and devices.
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