Milestone

Milestone

数据展示板块

Team

350+

30 Staffs

Area

20000+

1000m²

Equipment

2000+

50 Sets

Capacity

20+M

1M

Product

16-layer flash

USB Module

公司发展历程 - 时间轴

2013-2015

Start-up

Found in 2013 with 20 experts, focus on memory chip packaging.
Built strong partnerships with key upstream suppliers.
Established a solid foundation for rapid growth in the storage industry.

2016-2018

Rapid Growth

150+ staffs | ISO certification | 60+ patents.
Made breakthroughs in packaging technology, focusing on 4-layer Flash.
Expanded portfolio on high-capacity cards & BGA solutions.

2019-2021

Major Breakthrough

10000+ m² | 200+ staff | 10M+ monthly output | National High-Tech Enterprise.
Deployed wafer grinding & cutting machines, full end-to-end production.
Focused on 8-layer Flash packaging, embedded chips mass production.

2022-2025

Technical Mastery

300+ staffs | 20M+ monthly output | Awarded the SRDI Certified.
Equipment Upgrade, and fully implemented lean manufacturing.
Upgraded packaging tech to 16-layer Flash, enabling world-class production.

2026-Future

Innovation-Driven

New expansion phase launched, targeting 30M+ monthly capacity.
Introduced new product lines, including UFS and DDR memory solutions.
Independent innovation drives continuous iteration.