BGA

BGA packaging enables miniaturized designs and high-speed stable operation through higher density, superior thermal dissipation, and enhanced electrical performance, making it the mainstream packaging solution for embedded and high-performance chips.

▪ High-seal packaging ▪ Stable and efficient ▪ Excellent heat dissipation

Product Features

▪ High integration simplifies terminal design
▪ Standardized interfaces ensure strong compatibility
▪ Low power consumption extends battery life
▪ Data reliability guarantees security
▪ High-performance read/write capabilities meet diverse application needs
▪ Wide temperature range adapts to harsh environments

导航菜单
Custom & Applications Specification Related Products
Application Area

Consumer Electronics / IoT Terminals /Embedded Devices / Automotive Electronics / Medical Equipment/Industrial Control

Customized Service

As a source factory with end-to-end independent production capabilities and a seasoned technical team, NANDSTOR deeply understands the application characteristics and requirements of various devices. Based on this expertise, we design and manufacture eMMC products that deliver both high reliability and outstanding compatibility.

Product Parameter
Item
Specification
Description
Unit
Overview
 Interface NFI 4.2 & 5.1 & 5.0
/
Size 18 ×12
mm
Durability High and low temperature resistance: Waterproof; Drop-proof; Wear-resistant; X-ray-proof; Vibration-proof; Magnetic-proof; Shock-proof
/
HS code 8542321090
Performance
 Capacity 32-512
GB
Flash 3D NAND
/
Packaging BGA132
/
Work/Storage Environment
 Working Temperature Consumer grade:-0C~70°℃
Industrial grade:-40°C~85℃
℃
Storage Temperature -20-85
℃
working voltage 2.7-3.6
V
Humidity 0-95
/
Warranty
 / 3
Years
OEM/ODM
 / Custom printing logo / code / label / package, etc.
/
Certification
 / CE/ROHS/REACH/FCC
/
Note: The data is sourced from Nandstor Laboratory. Due to variations in equipment, the actual performance may differ.
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