About Us

诺沃斯科技展示版块

About Us

Novus is a high-tech enterprise in the semiconductor storage sector, integrating R&D, design, validation, packaging and testing, application, and sales. The company is committed to providing global customers with professional, reliable one-stop product solutions as well as comprehensive OEM & ODM customization services.

With over two decades of deep expertise in semiconductor storage, the team has established a complete production chain covering wafer sourcing, inspection, grinding, dicing, mounting, COB, molding, finished-product cutting, assembly, and testing. This enables full-process quality control from raw materials and manufacturing processes to finished products. Novus is among the few original manufacturers in the industry with true end-to-end in-house production capabilities and comprehensive quality management.

∎ Large-Scale Smart Manufacturing: 20,000+ m² facility in Shenzhen with 350+ employees and annual capacity over 200 million units. Lean manufacturing and digital systems ensure stable, scalable mass production.
 

∎ Advanced Packaging & Testing: Fully automated, internationally advanced equipment ensures process stability and product reliability.
 

∎ High Integration & Collaboration: R&D, design, validation, manufacturing, and sales work seamlessly for rapid product development and market delivery.
 

∎ Flexible Production & Delivery: We offer private-label products with dedicated support, and our agile manufacturing and delivery ensure we meet each client’s unique performance, reliability, and compatibility requirements.

∎ Comprehensive Quality Management: End-to-end quality control with a professional team, advanced equipment, and independent labs.

 

∎  Full-Process Control: Strict oversight from supply chain to delivery and after-sales, with SQE/QE/IQC/IPQC/FQC/OQC monitoring every step.

 

∎ Certifications: ISO 9001, ISO 14001, ISO 45001, BSCI, IATF 16949, and more.

 

∎ Compliance & Innovation: Over 100 core IPs; products meet international standards and certifications including REACH, UKCA, FCC, CE, and ROHS.

∎ Complete Production Chain: Full in-house production from wafer to final assembly, ensuring strict process control.

 

∎ Customized Solutions: Tailored products with independent R&D, design, and reliability testing to meet client needs.

 

∎ Full Customization: Logo, packaging, data programming, encryption, serial numbers, and firmware optimization.

 

∎ Expert Support: Experienced R&D team and labs provide efficient design, application, and after-sales support.

∎ Advanced Technology & Manufacturing: Expert team, cutting-edge equipment, and top-tier production ensure high-quality, reliable, and innovative products.

 

 ∎ Vertical Integration: Efficient collaboration from R&D to delivery through internal and upstream/downstream resources.

 

 ∎ Custom Solutions: Tailored designs for specific applications and device requirements.

 

 ∎  One-Stop Storage: Complete product line including SSDs, embedded, and mobile storage.

Our Journey

From our beginnings in manufacturing to our current innovation-driven approach, we have stayed focused on semiconductor memory. With ongoing technological advancements and consistent growth, we continue to contribute to the development and progress of the storage industry.

数据展示板块
Team
350+人
上升箭头
30 people
Size
20000+m²
上升箭头
1000m²
Equipment
2000+ units
上升箭头
50 units
Capacity
20+KK
上升箭头
1KK
Product
16-layer 3D NAND
上升箭头
USB Module
公司发展历程 - 时间轴
2013-2015

Operations Started

  • Founded by a core team of 20 experts, with a focus on memory chip packaging.
  • Built strong partnerships with key upstream suppliers to support development.
  • Product lineup led by TSOP and USB modules, complemented by memory cards.
  • Established a solid foundation for rapid growth in the storage industry.
2016-2018

Capabilities Strengthened

  • Built a strong talent pipeline, expanding the team to 150 employees.
  • Achieved ISO certification and secured numerous patents.
  • Made breakthroughs in packaging technology, focusing on 4-layer Flash.
  • Expanded product portfolio, concentrating on high-capacity memory cards and BGA solutions.
2019-2021

Achieving Breakthroughs

  • Awarded the “National High-Tech Enterprise” certification.
  • Expanded the factory to over 10,000 m², with a team of 200+ employees and a monthly production capacity exceeding 10 million units.
  • Implemented wafer grinding and dicing machines, building a complete end-to-end production chain.
  • Focused on 8-layer Flash packaging, achieving mass production of embedded chips.
2022-2025

Technical Mastery

  • Awarded the “Specialized, Refined, Distinctive, and Innovative” certification, and fully implemented lean manufacturing practices.
  • Team grew beyond 300 employees, with monthly production capacity rising to 20 million units.
  • Upgraded equipment, with a focus on embedded chip products
  • Packaging technology upgraded to 16-layer Flash, enabling world-class production.
2026-Future

Innovation-Driven Growth

  • Continued investment in process optimization and equipment upgrades.
  • Launched a new expansion phase, targeting a monthly production capacity of 30 million units.
  • Introduced new product lines, including UFS and DDR memory solutions.
  • Committed to independent innovation, enabling continuous iteration of technology and products.
Certifications & Compliance

The company places a strong emphasis on independent innovation and technological expertise, having accumulated over 100 core intellectual property rights, including invention patents, utility model patents, and software copyrights.

We implement strict quality management and have obtained certifications under authoritative systems, including ISO 9001, ISO 14001, ISO 45001, BSCI, and IATF 16949.All products comply with international standards and have obtained global certifications such as REACH, UKCA, FCC, CE, and RoHS.